Wafer thinning and wafer backgrinding service
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Wafer Thinning of Semiconductor WafersThe Valley Design Advantage - Wafer thinning experience spanning over 30 years, hundreds of customers, thousands of successfully completed wafer thinning jobs on numerous types of wafers.Wafer thinning and backgrinding services: (abrasive lapping or Disco backgrinding)
Single sided wafer thinning:Valley Design's wafer thinning method protects the process side of the wafer which often has various structures or devices already there. After stock thickness reduction step is performed, CMP is used to remove a minimum of 25 microns (.001"/ 1 mil), eliminating sub-surface damage (SSD). Available surface finishes on backside:
Various materials thinned:
Please call or e-mail for a quotation to meet your requirements. Return to Home Page: Polished silicon wafers and polishing services [an error occurred while processing this directive] |
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Valley Design East
Phoenix Park Business Center 2 Shaker Road, Bldg. E-001 Shirley, MA 01464 Phone: 978.425.3030 Fax: 978.425.3031 Valley Design West Santa Cruz, CA 95060 Phone: 831.420.0595 Fax: 831.420.0592 |