Silicon wafer polishing to tightest tolerances possible
|
Ultimate in Flat and Parallel Polished WafersSilicon wafers with TTV less than 1 micron are now possible, but not inexpensive. Even on fairly thin wafers, Valley Design can achieve flatness (bow and warp) of less the 5 microns.At present, Valley Design can process wafers up to 14" in diameter, and we offer surface finish as low as 2-3 Angstroms. For state-of-the-art semiconductor wafers, we believe, that if you can think it, we can do it. Try us! Return to Home Page: Polished silicon wafers and polishing services [an error occurred while processing this directive] |
|
|
|
Valley Design East
Phoenix Park Business Center 2 Shaker Road, Bldg. E-001 Shirley, MA 01464 Phone: 978.425.3030 Fax: 978.425.3031 Valley Design West Santa Cruz, CA 95060 Phone: 831.420.0595 Fax: 831.420.0592 
©2015 Valley Design Corp. All Rights Reserved |