Semiconductor wafer backgrinding and shaping

Semiconductor Material Wafer Backgrinding

  • Double side polished wafers to TTV < 1 micron
  • Silicon, Germanium, Gallium Arsenide, Gallium Phosphide, wafer shaping
  • Slicing to 5" diameter
  • Wafer edge grinding
  • Lapping to 300 mm diameter wafers
  • Wafer backgrinding, lapping, polishing
  • Dicing to 6" diameter
  • Optical grade materials from stock
  • Cylindrical grinding
  • Wafer thinning
  • Flattening
  • Complex wafer shaping
  • Surface flat orientation
  • Testing for type and resistivity
  • Downsizing
  • Process development and R & D

Request a quotation for all your backgrinding, polishing and special semiconductor material shaping needs!

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