Silicon Wafers: As Cut, Lapped, Etched, or Polished
FZ and CZ Silicon wafers in all sizes, orientations, and resistivities are processed in the USA, from small evaluation quantities to thousands of wafers.
Whether you need a single 25 mm diameter wafer 50 microns thick or 1000 wafers of 100mm Silicon polished on both sides to a thickness of 100 microns with TTV of 2½ microns, your requirements can be met.
Capabilities:
- SOI wafer polishing
- MEMS wafer polishing
- Glass and Silicon wafers for anodic bonding
- Backside and Double side Polishing
- Edge and angle polishing
- FZ Wafers and Ingots from stock
- Extremely Thin Wafers
- Germanium Wafers
- Your Custom Requirements
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